Products

Semiconductor Transfer System Business

Wafer Transfer Robot Series

4-Axis Cleaning Robot
Back and forth (X-axis), swivel (θ-axis), up-and-down (Z-axis) + hand rotation (0 to 180°) operations are possible, supporting wafer transfer in the atmosphere. The drive motor is an AC servomotor with absolute encoder specifications for all axes.
3-Axis Cleaning Robot
PHT-R-3 is a robot that operates on three axes: extension, rotation, and up and down. It is a horizontal multi-joint type for use in clean rooms.
Glass Substrate Cleaning Robot
It is capable of forward/backward (X-axis), turning (θ-axis), and up/down (Z-axis) movements, and is suitable for the atmospheric transportation of wafers.

Wafer Transfer Device Series

Wafer Cassette Changer
This system replaces the dicing frame for 200mm and 300mm stored in a specified cassette with a standard cassette. The cassettes used are 6-sheet cassettes and 13-sheet cassettes. Each cassette is supplied to the stage by an operator.
Wafer Transfer Device
As an additional function, it is possible to read the wafer ID laser-marked on the wafer surface and add an alignment function. Wafers of 200 mm and 300 mm can be handled depending on the carrier used and function. Supports face to face transfer and back to back transfer.
EFEM & Sorter
Equipped with a high-performance AC servo motor, it achieves high-speed transfer with ample payload capacity. Robots, load ports, and hands can be arranged optimally. Inherits decades of robotics technology operating in harsh environments. Failures are rare.
Semiconductor Cleaning Equipment Business

Wafer Cleaning Equipment Series

Automatic Wafer Demounter
This is a device that separates the wafer from the plate jig (beam) after wire sawing (slicing). This is a fully automated system that performs rough cleaning, separates wafers from plate jigs (beams), single-wafer cleaning, and wafer cassette storage.
Batch Type Wafer Cleaner
For SiC, separate specification meeting is required.
A batch-type device that performs optimal customization with a track record in a wide range of fields.
Carrier Substrate Receiving Cleaning Device
Cutting-edge chiplet packaging technology for next-generation semiconductors has been developed, and glass substrates are expected to be applied as packaging carrier substrates. We can propose a transportation and cleaning device for such glass carrier substrates.